Application Areas - CAE - THERMAL ANAYLSIS

I-DEAS TMG Thermal Analysis I-DEAS® TMG Thermal Analysis is a comprehensive modeling and simulation package which provides fast and accurate solutions to complex thermal problems. Using advanced numerical techniques, I-DEAS TMG Thermal Analysis makes it easy to model nonlinear and transient heat transfer processes including conduction, radiation, free and forced convection, fluid flow, and phase change. Leading edge finite differences technology provides solid reliability and superior solution speed for even the most challenging problems. With I-DEAS TMG Thermal Analysis, accurate thermal analysis can be performed quickly and effectively, delivering the engineering insight and turnaround speed needed to ensure success within today's rapid development cycles. I-DEAS Electronic System Cooling I-DEAS® Electronic System Cooling™ provides you with a comprehensive set of tools to simulate 3D airflow coupled with thermal behavior in electronic systems. With its powerful computational fluid dynamics capabilities, it is also ideal for many automotive, heating and ventilation, and industrial applications. As an integrated part of the I-DEAS package, models are created using I-DEAS 3D-design geometry using a simple and intuitive graphical interface. With I-DEAS Electronic System Cooling, you can effectively model individual components, multi-chip modules, heat sinks, and PC boards, as well as complete electronic systems. This allows you to perform digital thermal simulation early in the design process and reduces the need for building and testing physical prototypes. Prerequisites : Core Simulation